STATS ChipPAC

Gartner cuts IC-assembly forecast

EE Times (Free subscription) | 11/11/2008

Citing the IC downturn, Gartner Inc. has cut its forecast for the semiconductor assembly and test services (SATS) market.

STATS ChipPAC: STATS ChipPAC Reports Third Quarter 2008 Results

Market Wire - Electronics and Semiconductors: Optical Components (Free subscription) | 10/29/2008

SINGAPORE--10/30/2008, UNITED STATES (MARKET WIRE) STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced results for the third quarter 2008.

Tessera Provides Update on ITC Actions and Recent PTO Office Action

The Earth Times Online Newspaper (Free subscription) | 10/10/2008

SAN JOSE, Calif. - Tessera Technologies, Inc. (NASDAQ:TSRA), a leading provider of miniaturization technologies for the electronics industry, today provided a status update on certain legal actions.

• Tessera Provides Update on ITC Actions and Recent PTO Office Action - Business Wire

Semiconductor Makers Team Up for eWLB Technology

Red Orbit (Free subscription) | 10/04/2008

By Mumford, Richard ST Microelectronics (headquartered in Switzerland), STATS Chip- PAC (Singapore) and Infineon Technologies AG (Germany) have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon's first-generation technology, for use in manufacturing future- generation semiconductor packages.

STATS ChipPAC Selects E2open's Supplier Collaboration System to Enhance Visibility, Control and Collaboration Across Its Multi-enterprise Demand and Supply Network

PR News Wire (Free subscription) | 10/01/2008

REDWOOD CITY, Calif., Oct. 1 /PRNewswire/ -- STATS ChipPAC Ltd., a leading semiconductor test and advanced packaging service provider, today announced it has selected E2open's Global Supplier Collaboration System (GSCS) to enhance visibility, control and collaboration across its demand and supply network that spans multiple geographic locations. The backbone of the STATS ChipPAC supply management...

STATS ChipPAC: STATS ChipPAC Introduces Pre-Stacked PoP Solution

Market Wire - Electronics and Semiconductors: Micro-electronics and Nanotechnology (Free subscription) | 09/15/2008

SINGAPORE -- 9/16/2008, UNITED STATES (MARKET WIRE) STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today introduced a new Pre-Stacked Package-on-Package (PoP) solution that includes both a top and bottom PoP package that are assembled and tested separately, then stacked and reflowed together...

STATS ChipPac to provide services for Infineon

EE Times (Free subscription) | 08/28/2008

Singapore-based test and packaging vendor STATS ChipPac has entered into an agreement with Infineon Technologies AG to provide manufacturing services for products based on Infineon's first-generation embedded wafer-level ball grid array technology.

STATS ChipPAC: STATS ChipPAC Announces Manufacturing Agreement With Infineon on First Generation eWLB Technology

Market Wire (Free subscription) | 08/27/2008

SINGAPORE -- 8/28/2008, UNITED STATES (MARKET WIRE) STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced it has entered into an agreement with Infineon Technologies AG (FSE/NYSE: IFX) to provide manufacturing services for products based on Infineon's first generation embedded Wafer-Level...

STATS ChipPAC: STATS ChipPAC Offers Innovative USB Module for NAND Flash Memory Applications

Market Wire - Electronics and Semiconductors: Electronic Components (Free subscription) | 08/18/2008

SINGAPORE -- 08/19/2008, UNITED STATES (MARKET WIRE) STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced an innovative USB (Universal Serial Bus) module for NAND flash memory applications.

Questionable Stats ChipPAC funding plan unravels

Singapore News Alternative (Free subscription) | 08/17/2008

IFR Asia 16 Aug 2008 It was perhaps a straightforward reflection of that state of credit markets. Stats ChipPAC, 83.8%-owned by the Triple A rated Temasek, has seen its bond and loan ambitions unravel. The entity which at one point eyed a combined US$1.5bn funding via a bond and loan has been rebuffed. > > > > More

STATS ChipPAC delays benchmark bond sale

Business Times Asiaone (Free subscription) | 08/11/2008

(HONG KONG) STATS ChipPAC delayed its planned benchmark dollar bond sale of about US$500 million, but is looking to relaunch the deal as early as September, a source close to the deal said yesterday.

STATS ChipPAC: STATS ChipPAC Terminates Tender Offer and Consent Solicitation for Its Senior Notes

Market Wire (Free subscription) | 08/08/2008

SINGAPORE -- 08/08/2008 -- UNITED STATES (MARKET WIRE) STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, announced today that its tender offer and consent solicitation (the "Tender Offer and Consent Solicitation") in respect of its $150 million of 7.5% Senior Notes due 2010(1) and its $215 million...

STMicro, STATS ChipPAC and Infineon invest in 3D chip packages

TG Daily (Free subscription) | 08/08/2008

Most Popular More Related ArticlesPeople@TGDaily 10 things you didn't know about...Enderle Group AMD Freescale IDC Corsair Jon Peddie Research Intel Ultra Mobility Group HP Voodoo Business Unit SmallNetBuilder Read more at Special educational offers, white papers, webcasts, podcastsSTMicro, STATS ChipPAC and Infineon invest in 3D chip packages Hardware By Digitimes Friday, August 08, 2008 09:54 STMicroelectronics,...

ST, STATS ChipPAC license Infineon packaging

EE Times (Free subscription) | 08/07/2008

Infineon has granted licenses for its eWLB chip packaging technology to competitor STMicroelectroncis as well as to Singapore-based packaging engineering company STATS ChipPAC. The move will give the licensees the opportunity to benefit from higher integration and lower cost — and Infineon will benefit from higher market acceptance at large customers.

STMicroelectronics, STATS ChipPAC and Infineon to to Jointly Develop the Next-Generation Wafer-Level-Packaging Industry Standard

Nanotechnology News from Nanowerk (Free subscription) | 08/07/2008

STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG today announced that they have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array technology, based on Infineon's first-generation technology, for use in manufacturing future-generation semiconductor packages.

• STATS ChipPAC: STMicroelectronics, STATS ChipPAC and Infineon to Set New Milestone in Establishing Wafer-Level-Packaging Industry Standard - Market Wire - Electronics and Semiconductors: Electronic Components
• STMicroelectronics, STATS ChipPAC and Infineon to Set New Milestone in Establishing Wafer-Level-Packaging Industry Standard - The Earth Times Online Newspaper
• See the 5 articles on the same subject